Oppo: Oppo may start designing in-house chipsets for smartphones by 2023


Owned by BBK Electronics Oppo Big smartphone makers like Apple are now looking to follow the same path, Samsung And Google has already started taking. The Chinese smartphone maker has already designed its ISP (image signal processor), NPU (neural processing unit) and custom memory architecture called MariSilicon X. It claims to process Oppo’s noise reduction algorithm 20 times faster when it consumes half the power. Right now Snapdragon 888 powered flagship smartphone.
According to PhoneArena, Shanghai Zheku, Is working on an AP (application processor) for Oppo’s Integrated Circuit Design subsidiary. AP is a type of chipset that can be used on a smartphone. Reports also suggest TSMC This will build the next chip using the foundry’s 6nm process node and is expected to enter mass production by 2023.
Oppo is already planning to design a more powerful and energy-efficient chip in 2024 that will also be assembled by TSMC using its 4nm process node. The 4nm chipset will also include a 5G modem, however, it is still unclear whether the company will design its modem or go with third-party suppliers. Qualcomm And Samsung.
The next Oppo’s self-designed AP that will be manufactured in 2023 using a 6nm process node is likely to be used for its flagship devices. Next year will be like a pilot run for a chip manufacturing company to understand whether it should continue to design better chips each year and eventually design one for its flagship model. The 4nm chip that is planned for 2024 is more likely to be flagship material and OnePlus In the future Oppo may also use designed chipsets.
Apple has designed its A-Series chips and made them from TSMC, instead of Qualcomm or a MediaTek Chipset Samsung has also been designing and making its chips for a long time. Recently, Google has also stopped using Qualcomm chips for it Pixels As devices, the company has designed its own SoC for Pixel 6 series smartphones.
Earlier, Huawei It also designed its chips using its HiSilicon unit, however, due to US sanctions in 2020, it became extremely difficult for the Chinese manufacturer to get the latest chips for its phones, even what it designed. Huawei was forced to use Snapdragon 888 chipsets with all 5G technology disabled as the company ran out of inventory of its 5G Kirin chipsets. In recent days, Huawei has been TSMC’s second largest customer after Apple.

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