MediaTek: MediaTek launches Dimension 8100, Dimension 8000 and Dimension 1300 chipsets

Expanding its chipset portfolio, MediaTek Announces the All-New Dimension 8000 Series for Budget Premium Smartphones. The company has also unveiled a mid-range Dimension 1300 chipset.
Regular Dimension 8000 and in Dimension 8000 series Dimension 8100 According to the chips company, the new chipsets are expected to bring flagship level features, connectivity and performance to the budget flagship smartphones.
The new chipsets are based on the technology used with the Dimension 9000 platform and are built using TSMC 5nm manufacturing process.
Both the Dimension 8100 and Dimension 8000 chips have a total of eight cores. Also, both chips are equipped with four high performance ARM Cortex-A78 cores. However, cores at Dimension 8100 are clocked at 2.85GHz, while cores at Dimension 8000 are clocked at 2.75GHz.
Other than that, both chips come with ARM Mali-G6 GPU with MediaTek HyperEngine 5.0 gaming technology. The chipset also supports LPDDR5 memory and UFS 3.1 Storage.
The new Dimension 8000 series also uses MediaTek Open resource architecture To give device makers flexibility to customize and differentiate features.
The Dimension 8000 series also comes with MediaTek’s fifth generation AI processing unit, the APU 580.
MediaTek Dimension 8000 Category: Features

  • Camera up to 200MP and support for 4K60 HDR10 + videography.
  • Noise reduction and AI-based blur techniques
  • Simultaneous dual camera HDR video recording.
  • To enhance sub-6GHz performance using the leading 3GPP R16-ready 5G modem 2CC carrier aggregation.
  • 5G UltraSave 2.0 Power-Saving Enhancement Suite for Improved Functionality.
  • Support for Wi-Fi 6E and Bluetooth 5.3


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